Computex is one of the most important events for all lovers of technological novelties, where the most interesting solutions for graphics cards, processors, memory and motherboards are presented. As we well know, AMD wants to bring new iterations of its equipment to market as soon as possible in order to remain a company that is not only competitive but primarily innovative. One of those surprises is the chips’ completely new build, the so-called 3D Chiplet with a stack of 3D V-Cache. Nothing changes here in the basic Zen 3 design, but the red mods the look of the slide. What is it actually? Quite simply – everything under IHS, that is, a metal thermal conductor that protects the core and memory. On top of it we put the dough and the heat sink.
The updated AMD Ryzen 5000 processors will hit the market later this year
At least according to the company’s optimistic plans, we should find restored modules on store shelves in 2021. The use of the new chip includes a change in the chip architecture, adding more Level 3 (L3) cache. Previously, we had 32 MB, now thanks to 3D V-Cache we will get twice as much – 64 MB, which will give a total of 96 MB. In general, it will be possible to implement 196 MB of L3 cache, which is literally ridiculous among consumer processors.
AMD showed the results of its work on the example of the AMD Ryzen 5900X unit. As you might expect, this will lead to a significant increase in performance, thanks to which we will see on average 15% more frames shown in games. In Monster Hunter: World it was 25%. Sound tempting? For current owners of Ryzen 5000 processors, not necessarily, but for those using older generations of CPUs, yes.
I wrote earlier that Lisa Su RDNA 3 and Zen 4 architecture premieres confirmed in 2022. I encourage you to read. In the meantime, let’s focus on the next steps for AMD itself. A processor with a 3D V-Cache stack uses silicon TSV connections (with a cosmic bandwidth of 2 terabytes / s), each with a size of 17 micrometers. Their task is to connect the memory to the main CCD block, which is currently made in 7-nm lithography. This will likely provide the possibility to install up to 512MB of L3 memory per single block with cores, and in the future even double these numbers. Incredible technology, very forward-looking and very exciting in the context of increasing productivity gains in 2022 and 2023. Next-gen consoles should be careful, because we’ll already have PRO versions somewhere in 36 months at the most.
Personally, I am very happy with this information, because I am a huge fan of new products in the processors or graphics cards themselves. Intel systems promise to be amazing – Arch, that is, direct competition in the gaming GPU segment of AMD and NVIDIA. It’s great that the third player is about to debut on the market, because for consumers it means more fierce price and offer competition, and these “battles” always end with exciting promotions. I don’t think Intel is going to have an equal fight right away, just in terms of driver development, but I’m glad they got into this market so quickly. After all, the work on designing a completely new GPU took only 4 years, which is almost a standard result in the world of such complex hardware.
AMD 3D Chiplet Technology: A breakthrough in packaging for high-performance computing.
– AMD (@AMD) June 1, 2021
Although 3D Chiplet and 3D V-Cache look very interesting on paper and sketches, we’ll only see after the first tests how it actually performs. Another thing is that its more accurate and better use will only appear in the following models of Ryzen processors, namely the 6000 version, which is already based on the Zen 4 architecture. However, this is an exciting technology that could deliver massive increases in tire counts over the next 24 months. Then, changing the IPC itself will not only give us performance, but also an increased number of third-level caches.
Adding such tweaks will have a noticeable effect on the speed of the application for professionals, for example 3D graphic design or movie editing programs. I’m keeping a close eye on the coming months, because as I mentioned before – a huge jump in performance is being prepared for PC owners, and just over a year after the premiere of next-generation consoles. Our governor won’t take it lightly. Although many of you associate the PC Master Race with a seat and a small screen, they are such cool inventions as ultra-wide screens, and I even tested one recently. It changes the perspective and approach of gaming on PC, so it would be worth considering a potential change. Speak soon!
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